Heatspreader Material

High-performance materials with high thermal conductivity and coefficient of thermal expansion suitable for electronic devices.

Optimum materials for heat management of semiconductor devices

   - Cu-W (Copper Tungsten)
   - CuDia (Copper Diamond)
   - AlN (Aluminium Nitride)
   - Cu-Mo (Copper Molybdenum)

Manufactured in Japan by Sumitomo Electric Group company, ALMT